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铝碳化硅在功率电子散热方面的应用
发布时间:2019-11-06 15:21:55 发布人: 浏览:2905
  

演讲嘉宾:

Dan White ,

Thermal Transfer Composites,LLC CEO

无压渗铝工艺,铝碳化硅的发明人

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Dr. DanWhite is the President and co-founder of Thermal Transfer Composites, a leadingmanufacturer of thermal management components and materials. Dr. White has beenat the forefront of metal matrix composite development for advanced thermal andstructural applications, starting in 1985 at Lanxide Corporation.   Dr. White has been granted over 50 US and corresponding foreignpatents in the area of composite material processing and material systems, andis the inventor of the PRIMEX TM Pressureless Metal Infiltration Process thatforms the basis of Thermal Transfer Composite’s diverse manufacturing systems,including both castable and infiltrated aluminum silicon carbide composites.  ThermalTransfer Composite’s products are used in many power conversion and telecomapplications, ranging from base plates for high voltage IGBT power modules forelectric and hybrid vehicles, and mass transit/traction systems, to heatspreaders for LDMOS and other high performance telecom packaging.


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